2.5D/3D IC packaging heater
On the line, 2.5D/3D stacks don’t fall apart because the concept is wrong—they fail from thermal drift. Give or take a few degrees across the...
Compact infrared dryer for IC
On the fab floor, a soft bake that drifts by 2°C will shift a photoresist profile. A hard bake that runs hot at the edge can leave scum. A compact...