Wafer drying module 200mm

Thu, 25 Jun 2026 04:52:17 +0800

On a 200mm line, one wet step can quietly kill yield. Water left behind after cleaning shows up as a watermark on the photoresist, and then a soft bake drift pushes critical dimension control out of spec. You can’t paper this over with operator tweaks—what you need is a drying module that behaves the same, shift after shift. What matters under the hood Our 200mm wafer drying module is built around controlled thermal delivery and contamination control. Temperature uniformity across the wafer is held within ±0.1°C, so soft bake and hard bake profiles stay consistent lot to lot. The system fits cleanroom classes 1–100 and is engineered for zero particle generation, supporting the tight particle count targets we live by in lithography. In 24/7 operation, the design aims for zero unplanned downtime, with service life measured in tens of thousands of hours. Repeatability isn’t a talking point—it’s the baseline. Why it fits the floor This module slots straight into 200mm processing, from post-clean drying to photoresist bake steps. Tight thermal control cuts photoresist defects tied to thermal budget excursions, and consistent drying removes the variability that drives rework. The payoff: fewer scrap lots, higher machine utilization, and line-of-sight on critical dimensions that actually stays stable. We keep energy use in check without sacrificing setpoint accuracy, so operating cost stays predictable. The practical details Installation has to match the exhaust and vibration constraints of the wet bench or track interface. The module performs within spec when it’s on a clean, stable power source, and preventive maintenance—filter checks and sensor calibration—keeps long-term drift negligible. Plan the maintenance window. It’s small, but it’s non-negotiable.

Zoned infrared heating module

Tue, 23 Jun 2026 00:11:50 +0800

On the fab floor, you know the drill: a 0.2°C drift in bake temperature and your photoresist profile goes from within spec to scrap. Conventional hotplates fight edge roll-off and across-wafer non-uniformity, forcing you to tighten control limits and chase excursions. We built the zoned infrared heating module to take that variability out of soft bake and hard bake where it counts—right at the wafer. What matters under the hood Short-wave infrared with independent, closed-loop zone control delivers wafer-level uniformity of ±0.1°C at the resist surface. Temperature settles in seconds, so thermal ramp time drops and you get tighter process windows. It runs in Class 1–100 cleanrooms with zero particle generation, confirmed by in-situ monitoring and a low-outgassing design. The uptime is 24/7, with MTBF that lines up with the expectations we all have for semiconductor equipment. Why it works in lithography is simple: bake repeatability drives CD control and yield. With zoned heating, you cut thermal budget variability, so soft bake and hard bake stay consistent across lots, wafers, and shifts. That means fewer reworks, less scrap, and critical dimension performance that stays put. Energy use drops, too, because the module heats only the target zones and keeps thermal coupling into adjacent tools to a minimum. Installation needs a clean, flat mounting surface and enough clearance for the IR emitter array. Retrofit kits fit common tracks, but mechanical envelopes vary by platform. To hit the ±0.1°C uniformity, the module has to be calibrated to your resist thermal profile—we provide a traceable procedure for that. Once it’s set, the process stays locked, but if you change resist chemistry, plan on a re-qualification run.

Module on Factory Direct Infrared Heating

Wafer drying module 200mm

Zoned infrared heating module